The Picotuner PCB has heatsink pads below voltage regulators U2, U4, U5 and U6. Is it recommended to use thermal grease below the devices, or to attempt to solder them to the pads - or are they likely to remain cool enough without? (I soldered U1 as per the online instructions.)
Many thanks to Mike G0MJW and all involved with this project!
Chris
Picotuner regulator heatsink requirements
Re: Picotuner regulator heatsink requirements
These devices must be soldered to the pads. That's how they work.
Re: Picotuner regulator heatsink requirements
Thanks Mike.
I've now found reference to that in the online TI datasheet on p.24, so I guess it's (another!) case of RTFM.
Thanks,
Chris
I've now found reference to that in the online TI datasheet on p.24, so I guess it's (another!) case of RTFM.
Thanks,
Chris
Re: Picotuner regulator heatsink requirements
Good. Sorry for the short reply as I was in a meeting. The devices are designed to be soldered to the PCB and the PCB is used as a heatsink. In many cases it is also the ground connection.
Mike
Mike